Wafer Processing & Manufacturing

From Development to Pilot-Scale Production

Leverage the synergies of the Terahertz Sensory Performance Centre and benefit from our expertise in wafer processing for the development of tailored high-frequency systems. We support you from the initial idea to prototype development and pilot production – efficiently, flexibly, and application-driven.

Eine Person mit weißen Handschuhen hält einen Siliziumwafer, auf dem zahlreiche Mikrochips für die Terahertzsensorik in regelmäßiger Anordnung zu sehen sind. Die Oberfläche des Wafers zeigt einen schillernden Farbeffekt durch Lichtreflexionen. A person wearing white gloves holds a silicon wafer showing numerous microchips for terahertz sensing arranged in a regular pattern. The wafer surface displays an iridescent color effect from light reflections.

Your Advantages at a Glance

Seamless Process: From prototypes to pilot-scale manufacturing — all from a single source

State-of-the-Art Cleanroom Infrastructure: 1,900 m² ISO 4 and 400 m² ISO 6

Fully Automated 200 mm Cassette-to-Cassette Wafer Handling: For maximum process reliability

Flexibility: Support for established CMOS and innovative post-CMOS technologies

Industry-driven R&D: Processes and capacities scalable to pre-series and small-batch production

High Precision: Customized technologies for high-frequency, photonics, and MEMS applications

Eine Person in Reinraumkleidung bedient ein Gerät mit einem schimmernden Wafer für Terahertzsensorik. A person in cleanroom attire operates a device with a shimmering wafer for terahertz sensing.

Overview of Our Fabrication Capabilities

CMOS and OPTO processes

0.35 µm CMOS processes for logic and standard circuits

OPTO processes for optoelectronic applications such as sensors

Fabrication of complex, high-performance chips for a wide range of application fields

Post-CMOS technologies for increased integration density, energy efficiency, and new functionalities

MEMS integration (micro-electro-mechanical systems): Integration of mechanical components with electronic circuits on CMOS substrates

Photonic integration: Bonding of photonic chips with electronics (e.g., for LiDAR)

QMI technology (quantum dot midwave infrared integration): Incorporation of quantum dot materials into photonic layer stacks for midwave infrared applications

Flexible extensions: RFID, heterointegration, and custom substrates

In Regenbogenfarben schillernde Nahaufnahme eines Wafers. Close-up of a wafer shimmering in rainbow colors.

Typical Fields of Application

Development and fabrication of chips for terahertz and radar systems

Integration of photonic components into LiDAR and imaging systems

MEMS-based sensing solutions for automotive and industrial applications

RFID solutions for wireless applications

Prototype and volume production of customized RF systems

From Concept to pilot-scale Production

We combine internal and external services into a seamless development and fabrication process. In this way, we carry out your research and development projects – reliably, efficiently, and with the highest level of technological precision.