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Terahertz sensor technology performance centre

Innovative partner for high-frequency technology and system development

Frau erklärt ein Schaltbild an einem Whiteboard vor einer kleinen Gruppe in einem Besprechungsraum.

© Fraunhofer IMS/Andi Werner Photography

From the idea to the functional chip

Research services

We support you in the new and further development of circuit elements that are used in modern applications such as smart, networked sensor solutions.

DSt: We support you in the development of novel and the improvement of existing circuit elements, that are used in modern applications, such as smart, connected sensor solutions.

Customised on-chip solutions for high-frequency applications

Precise analysis of new chips up to 120 GHz using spectral and network analysers; in-situ characterisation of bonded chips using network analysis up to 500 GHz

Validation of circuits under real conditions

Future technologies for your application

Technology Services

Our portfolio includes post-CMOS technologies, MEMS, optical sensors and photonic circuits to give you a technological edge.

Utilisation of the latest semiconductor processes for higher integration densities and energy efficiency

Combination of mechanical and electrical components for compact systems

High-precision measurement solutions even under extreme environmental conditions

Integration of several functions on one chip to save costs and space

DSt: Co-Integration of optical and electrical functionalities on a single chip for cost- and size-reduction

Material and module analysis for the terahertz range

Zwei Personen in Reinraumkleidung bedienen einen Computer in einem Labor.

© Fraunhofer IMS

Halbrundes Bauteil aus Metall mit dem Logo ‚Fraunhofer FHR‘ auf spiegelnder Oberfläche, darunter ein ebenfalls gelabelter Kugelschreiber zur Größenreferenz.

© Fraunhofer IMS

From prototype to small series

System development

We transform your product vision into market-ready solutions – supported by rapid prototyping, 3D printing and in-house PCB assembly.

Rapid realisation with state-of-the-art prototyping techniques

From automated electronics assembly to CNC machining - for reproducible quality

Complex wireless systems, antennas and filters up to 120 GHz

Comprehensive production expertise

Assembly technology and production

Our production centre guarantees maximum precision at every stage.

Wire bonding with materials such as gold and aluminium wires for RF-compatible connections of the highest precision (placement accuracy <5 µm) as well as chip-film patch for mechanically flexible systems by bonding on polyimide films and hybrid bonding by combining different chip technologies (CMOS + MEMS) in a single package.

Starting with fully automated assembly with automated optical inspection (AOI), we have the core competences of an electronics manufacturing serives (EMS) provider. Due to the in-house operation of our machinery, including internal material procurement, lead times for prototypes are drastically reduced, while maximising flexibility. For larger batches, we have a partner network of qualified EMS and use industry standards for exchange formats.

5-axis CNC machining for the production of precise high-frequency components (down to the lower terahertz range); use of 3D printing processes (including metal and plastic laser sintering) for millimetre-wave components; electroplating surface finishing (gold/nickel plating) even at sub-millimetre wavelengths.

Techniker bei der Fertigung elektronischer Platinen mit automatisierter Hightech-Maschine.

© Fraunhofer FHR

Licht wird über Glasfasern in einen photonischen Chip (PIC) mit integriertem Wellenleiter eingekoppelt. Detailansicht zeigt leuchtenden Resonator. Maßstab: 1 cm / 1 mm.

© Fraunhofer IMS

Photonics integration

Optical interfaces
Bonding of photonic chips with electronic circuits (e.g. for LiDAR systems)

QMI-Technology
Quantum dot midwave infrared integration for improved optical coupling

Precision without compromise

Measuring services

Our laboratories with an anechoic antenna measurement chamber enable interference-free analyses.

Spectral and network analysis
Up to 120 GHz

Time domain measurements
Multi-channel systems up to 65 GHz

Material characterisation
Non-destructive testing methods for quality management and research

Innenansicht einer schallgedämpften Messkammer mit pyramidenförmigen Absorbern zur Vermeidung elektromagnetischer Reflexionen.

© Fraunhofer IMS

3D-gedruckte Antenne.

© Fraunhofer FHR

Your Benefits

Strengthen your technological edge – with a partner who combines terahertz expertise and industrial practice.

Scientific excellence: Access to the latest research results from the Fraunhofer Institutes.

One technology, many possible applications

  • Inline measurement technology for resource-efficient production
  • Medical technology: Non-contact sensors for diagnostic procedures
  • Security technology: High-resolution terahertz imaging systems
  • Telecommunications: Wireless transmission systems with extremely high data rates

Contact us for a customised offer

Take advantage of our terahertz expertise and industrial experience for your technological advantage. Whether medical technology, security or communication – together we will realise your innovation.

We look forward to your request