We support industry and research in the development of tailored chips and systems for terahertz sensing. From concept and simulation to chip design, prototyping, testing, and integration, you get everything from a single source. Our experts combine years of experience in RF and photonics design with state-of-the-art manufacturing capabilities – delivering compact, scalable, and energy-efficient sensor solutions.
SiGe chip in the sink of a PCB with bond wires. © Fraunhofer FHR
We develop tailored integrated circuits (ICs) and MMICs for the highest frequencies. Efficient, miniaturized, and industrial-grade.
Whether FMCW, MIMO, or RFID – We explore solutions for precise 3D imaging, contactless monitoring, and industrial communications.
Our industry grade, modular FMCW transceiver systems in various frequency bands are an ideal foundation for further development, as well as for prototyping and pre-series development.
Integration of photonics and electronics for maximum performance – from PICs to CMOS-compatible technologies.
CMOS, optical, and Post-CMOS processes, MEMS, and more – industry-relevant processes for prototypes and pre-series and small runs.
Comprehensive RF and photonics measurements for quality assurance, optimization, and verification in research and development.
Whether prototype, pre-series development, or a specialized technology inquiry – we support your R&D initiatives individually and accompany your project from the very start. Contact us for your chip development for terahertz sensing.
